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dc.contributor.authorKalaš, David
dc.contributor.authorŠíma, Karel
dc.contributor.authorKadlec, Petr
dc.contributor.authorPolanský, Radek
dc.contributor.authorSoukup, Radek
dc.contributor.authorŘeboun, Jan
dc.contributor.authorHamáček, Aleš
dc.date.accessioned2022-01-31T11:00:27Z-
dc.date.available2022-01-31T11:00:27Z-
dc.date.issued2021
dc.identifier.citationKALAŠ, D. ŠÍMA, K. KADLEC, P. POLANSKÝ, R. SOUKUP, R. ŘEBOUN, J. HAMÁČEK, A. FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymers. Polymers, 2021, roč. 13, č. 21, s. 1-16. ISSN: 2073-4360cs
dc.identifier.issn2073-4360
dc.identifier.uri2-s2.0-85118479478
dc.identifier.urihtthp://hdl.handle.net/11025/46669
dc.format16 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherMDPIen
dc.relation.ispartofseriesPolymersen
dc.rights© authorsen
dc.titleFFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymersen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThe present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC). Considering their intended usage in electronic applications, the dielectric strength (Ep) and surface/volume resistivity (rs/rv) were comprehensively tested according to IEC 60243-1 and IEC 62631-3, respectively. The values of the dielectric constant and loss factor were also determined by broadband dielectric spectroscopy (BDS). While, on the one hand, exceptional dielectric properties were observed for some thermoplastic elastomers, the materials based on PCs, on the other hand, stood out from the others due to their high oxidation stability and above average dielectric properties. The low-cost materials based on PETG or ABS T did not achieve thermal properties similar to those of the other tested polymers; nevertheless, considering the very reasonable price of these polymers, the obtained dielectric properties are promising for undemanding electronic applications.en
dc.subject.translated3D printingen
dc.subject.translatedfilament materialsen
dc.subject.translateddielectric parametersen
dc.subject.translatedthermal parametersen
dc.identifier.doi10.3390/polym13213702
dc.type.statusPeer-revieweden
dc.identifier.document-number726930600001
dc.identifier.obd43933820
dc.project.IDFW03010077/InTechTex - Inovativní technologie integrace a pouzdření elektronických prvků pro smart textilie odolávající náročným podmínkámcs
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
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