| Issue Date | Title | Author(s) |
| 2019 | Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate | Hirman, Martin; Navrátil, Jiří; Steiner, František; Džugan, Tomáš; Hamáček, Aleš |
| 2019 | Bend testing of SMD chip resistors glued on flexible substrates | Hirman, Martin; Neuhöfer, Tomáš; Steiner, František |
| 2019 | Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate | Hirman, Martin; Steiner, František; Navrátil, Jiří; Hamáček, Aleš |
| 2020 | Design, fabrication and risk assessment of IoT unit for products manufactured in industry 4.0 factory | Hirman, Martin; Benešová, Andrea; Šíma, Karel; Steiner, František; Tupa, Jiří |
| 2019 | Determination of changes in process management within industry | Benešová, Andrea; Hirman, Martin; Steiner, František; Tupa, Jiří |
| 2017 | Diagnostika propojovacích struktur součástek a substrátů | Hirman, Martin |
| 2020 | Electrical resistance of solder joints on conductive ribbons | Hirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš |
| 2015 | Influence of electrically conductive adhesive amount on shear strength of glued joints | Steiner, František; Hirman, Martin |
| 2020 | Influence of production and operating conditions on properties of acrylic conformal coatings | Steiner, František; Hirman, Martin; Rous, Pavel; Hornak, Jaroslav |
| 2018 | Kontaktování SMD součástek na flexibilní DPS s pomocí nevodivých lepidel | Navrátil, Jiří; Hirman, Martin |
| 2013 | Optimalizace skladových procesů | Hirman, Martin |
| 2019 | Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs | Hirman, Martin; Steiner, František |
| 2020 | Optimization of contacting technological process on printed conductive pattern for wearable electronics | Benešová, Andrea; Hirman, Martin; Hlína, Jiří; Tupa, Jiří; Steiner, František; Řeboun, Jan |
| 2019 | Project management during the industry 4.0 implementation with risk factor analysis | Hirman, Martin; Benešová, Andrea; Steiner, František; Tupa, Jiří |
| 2019 | Relationship of soldering profile, voids, formation and strength of soldered joints | Steiner, František; Wirth, Václav; Hirman, Martin |
| 2019 | Reliability of glued joints on flexible substrates during accelerated current ageing | Hirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš |
| 2020 | Reliability of glued SMD components on smart textile | Hirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš |
| 2019 | Requirements for education 4.0 and study programs within industry 4.0 | Benešová, Andrea; Hirman, Martin; Steiner, František; Tupa, Jiří |
| 2019 | The testing of brass solderability for hybrid sewing thread | Pavec, Martin; Hirman, Martin; Soukup, Radek; Hamáček, Aleš |
