Title: Properties of 3D LTCC structure inteconnections
Authors: Nicák, Michal
Psota, Boleslav
Kosina, Petr
Starý, Jiří
Šandera, Josef
Citation: Electroscope. 2012, č. 6, EDS 2012.
Issue Date: 2012
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: konferenční příspěvek
URI: http://hdl.handle.net/11025/1044
ISSN: 1802-4564
Keywords: nízkoteplotně vypalovaná keramika;substráty;3D pájené spoje
Keywords in different language: low temperature co-fired ceramic;substrates;3D soldered interconnections
Abstract in different language: This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting “zero shrink” Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.
Rights: © 2012 Electroscope. All rights reserved.
Appears in Collections:Číslo 6 - EDS 2012 (2012)
Číslo 6 - EDS 2012 (2012)

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