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DC poleHodnotaJazyk
dc.contributor.authorPsota, Boleslav
dc.contributor.authorSzendiuch, Ivan
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2013-01-31T14:13:11Z
dc.date.available2013-01-31T14:13:11Z
dc.date.issued2012
dc.identifier.citationElectroscope. 2012, č. 6, EDS 2012.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2012/Cislo6_2012/r6c6c6.pdf
dc.identifier.urihttp://hdl.handle.net/11025/1047
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rights© 2012 Electroscope. All rights reserved.en
dc.subjectteplotní managementcs
dc.subjectelektronické paketycs
dc.titleThe increasing importance of the thermal management for modern electronic packagesen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper deals with the significance of the thermal management for some modern types of electronic packages. The main part is focused on the Quad-Flat No-leads (QFN) package and its mounting ways and means, which depends significantly on their thermal characteristic. Apart from that, thermal properties of the Ball Grid Array (BGA) package were also calculated as well as thermal resistances for each structure. All results were gained through the computer simulations, which were done in ANSYS program.en
dc.subject.translatedelectronic packagesen
dc.subject.translatedthermal managementen
dc.type.statusPeer-revieweden
Vyskytuje se v kolekcích:Číslo 6 - EDS 2012 (2012)
Číslo 6 - EDS 2012 (2012)

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