Title: Frequency bandpass filter in hybrid thick film technology
Authors: Pulec, Jiří
Szendiuch, Ivan
Citation: Electroscope. 2013, č. 1.
Issue Date: 7-Feb-2013
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
article
URI: http://147.228.94.30/images/PDF/Rocnik2013/Cislo1_2013/r6c6c1.pdf
http://hdl.handle.net/11025/1884
ISSN: 1802-4564
Keywords: frekvenční filtr;tlusté vrstvy
Keywords in different language: frequency filter;thick films
Abstract in different language: In current electronics technology, important devices are frequency filters. These devices are used in many applications, mostly in communication technology, e.g. splitters, ADSL modems etc. In technology of manufacturing of these devices, mostly the discrete components soldered on main substrate, mostly its components are realized in SMD. This is good solution for commercial field, because this technology is well known. For industrial and military and industrial, high reliability is required. This article describes the design of planar frequency bandpass filter and results of its testing. The attention is devoted to the differences between the device theoretically designed and the device which was actually realized.
Rights: © 2013 Electroscope. All rights reserved.
Appears in Collections:Číslo 1 (2013)
Číslo 1 (2013)

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