Full metadata record
| DC pole | Hodnota | Jazyk |
|---|---|---|
| dc.contributor.author | Fiala, Pavel | |
| dc.contributor.author | Běhunek, Ivo | |
| dc.contributor.author | Steinbauer, Miloslav | |
| dc.contributor.editor | Ulrych, Bohuš | |
| dc.date.accessioned | 2017-04-03T06:35:46Z | |
| dc.date.available | 2017-04-03T06:35:46Z | |
| dc.date.issued | 2007 | |
| dc.identifier.citation | AMTEE ’07 : seventh international conference on Advanced Methods in the Theory of Electrical Engineering : September 10-12, 2007 [Pilsen, Czech Republic]. | en |
| dc.identifier.isbn | 978-80-7043-564-9 | |
| dc.identifier.uri | http://amtee.zcu.cz/AMTEE/ArchivedProceedings/proceedings_AMTEE_2007/data/section_i.html | |
| dc.identifier.uri | http://hdl.handle.net/11025/25795 | |
| dc.format | 6 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en | en |
| dc.publisher | University of West Bohemia | en |
| dc.rights | © University of West Bohemia | en |
| dc.subject | změna fáze | cs |
| dc.subject | metoda konečných prvků | cs |
| dc.subject | teplo | cs |
| dc.subject | integrovaný obvod | cs |
| dc.title | Phase change materials for thermal management of Ic packages | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.rights.access | openAccess | en |
| dc.type.version | publishedVersion | en |
| dc.description.abstract-translated | This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems.The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally. | en |
| dc.subject.translated | phase change | en |
| dc.subject.translated | finite element method | en |
| dc.subject.translated | heat | en |
| dc.subject.translated | integrated circuit | en |
| dc.type.status | Peer-reviewed | en |
| Vyskytuje se v kolekcích: | CPEE – AMTEE 2007 CPEE – AMTEE 2007 | |
Soubory připojené k záznamu:
| Soubor | Popis | Velikost | Formát | |
|---|---|---|---|---|
| Fiala.pdf | Plný text | 810,31 kB | Adobe PDF | Zobrazit/otevřít |
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