| Title: | Testování ohebnosti flexibilních elektronických prvků a systémů |
| Other Titles: | Flexibility testing of flexible electronic components and systems |
| Authors: | Skřivan, Jan |
| Citation: | FIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 26. – 27. října 2017. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2017, s. [55-59]. |
| Issue Date: | 2017 |
| Publisher: | Západočeská univerzita v Plzni |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://hdl.handle.net/11025/26452 |
| ISBN: | 978–80–261–0712–5 |
| Keywords: | flexibilní elektronika;flexibilní podklad;test ohybu |
| Keywords in different language: | flexible electronics;flexible substrate;bend test |
| Abstract in different language: | This paper is focused on the design and realization of a bend test for flexible electronics. The proposed test method is then verified on the device. For this purpose, samples have been designed and implemented with SMD components connected by three different conductive adhesives. The results of the samples that are measured by four point method are then compared. |
| Rights: | © Západočeská univerzita v Plzni |
| Appears in Collections: | 2017 2017 |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Skrivan.pdf | Plný text | 654,59 kB | Adobe PDF | View/Open |
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