Full metadata record
DC FieldValueLanguage
dc.contributor.authorHlína, Jiří
dc.contributor.authorŘeboun, Jan
dc.contributor.authorHamáček, Aleš
dc.date.accessioned2018-11-07T13:05:21Z-
dc.date.available2018-11-07T13:05:21Z-
dc.date.issued2018
dc.identifier.citationElektrotechnika a informatika 2018: XIX. ročník konference doktorských prací, Zámek Nečtiny, 25. – 26. října 2018: Elektrotechnika, Elektronika, Elektroenergetika, 2018, s. 35-39.cs
dc.identifier.isbn978–80–261–0785–9
dc.identifier.urihttp://hdl.handle.net/11025/30698
dc.description.sponsorshipTento článek vznikl za podpory interního projektu na podporu studentských vědeckých konferencí SVK-2018-005 a projektu SGS-2018-016: Diagnostika a materiály v elektrotechnice.cs
dc.format4 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isocscs
dc.publisherZápadočeská univerzita v Plznics
dc.relation.ispartofseriesElektrotechnika a informatikacs
dc.subjectaluminacs
dc.subjectměďcs
dc.subjectvícevrstvá strukturacs
dc.subjecttlustá vrstvacs
dc.titleVlastnosti vícevrstvých TPC strukturcs
dc.title.alternativeProperties of multilayer TPC structuresen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper is focused on multilayer Thick Printed Copper (TPC) structures on alumina substrates and the testing of their mechanical and electrical properties. Multilayer thick printed copper is a new prospective technology based on sequential printing of copper and dielectric films and their firing in an inert atmosphere. It can be used for power electronics substrate manufacturing. These substrates are used in special applications such as concentrated photovoltaics, smart power modules etc. Adhesion and electrical parameters such as capacity, dielectric constant, resistivity, breakdown voltage, dielectric strength etc. before and after thermal cycling and aging are mentioned in this paper.en
dc.subject.translatedaluminaen
dc.subject.translatedcopperen
dc.subject.translatedmultilayer structureen
dc.subject.translatedthick filmen
dc.type.statusPeer-revieweden
Appears in Collections:Konferenční příspěvky / Conference papers (KET)
2018
2018

Files in This Item:
File Description SizeFormat 
Hlina.pdfPlný text714,46 kBAdobe PDFView/Open


Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/30698

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.