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Collection's Items (Sorted by Submit Date in Descending order): 1 to 20 of 51
Hirman, Martin , Benešová, Andrea , Steiner, František , Tupa, Jiří
Project management during the industry 4.0 implementation with risk factor analysis

Benešová, Andrea , Hirman, Martin , Steiner, František , Tupa, Jiří
Determination of changes in process management within industry

Maračková, Lucie , Pospíšil, Jan , Mraček, Lukáš , Syrový, Tomáš , Hamáček, Aleš , Zmeškal, Oldřich
Temperature modulated field effect in organic electrochemical transistor with ionic liquids

Hardoň, Štefan , Kúdelčík, Jozef , Hornak, Jaroslav , Michal, Ondřej , Totzauer, Pavel , Trnka, Pavel
The Influence of ZnO nanoparticles in the epoxy resin on the complex permittivity and dissipation factor

Hirman, Martin , Steiner, František , Navrátil, Jiří , Hamáček, Aleš
Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate

Hlína, Jiří , Řeboun, Jan , Johan, Jan , Hamáček, Aleš
Advanced application capabilities of thick printed copper technology

Totzauer, Pavel , Trnka, Pavel
Different ways to improve natural ester oils

Michal, Ondřej , Mentlík, Václav , Hornak, Jaroslav , Trnka, Pavel , Totzauer, Pavel
Effect of thermal stress on the hybrid fibre/particle nanocomposite

Hardoň, Štefan , Kúdelčík, Jozef , Trnka, Pavel , Totzauer, Pavel , Hornak, Jaroslav , Michal, Ondřej
The influence of ZnO nanoparticles on the dielectric properties of epoxy resin

Benešová, Andrea , Hirman, Martin , Steiner, František , Tupa, Jiří
Requirements for education 4.0 and study programs within industry 4.0

In recent years, there has been significant development in the area of implementation of digitization, information systems and new technologies into production. This has led to the emergence of a new industrial revolution, known as Industry 4.0. This revolution will allow for increased&...

Hirman, Martin , Neuhöfer, Tomáš , Steiner, František
Bend testing of SMD chip resistors glued on flexible substrates

The paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton...

Blecha, Tomáš , Čengery, Jiří , Pretl, Silvan , Smítka, Václav
Planar resonance circuits for identity documents or banknotes authentication

This paper deals with the design and realization of planar resonant circuits, which are part of a system designed to verify the authenticity of identity documents or banknotes. Validation or authentication is performed based on the evaluation of resonant frequency changes due to th...

Navrátil, Jiří , Řeřicha, Tomáš , Smítka, Václav , Hamáček, Aleš
Double sided printed pattern interconnected by Aerosol Jet and NCA technologies

This paper presents interconnecting of printed electronics patterns by printing technologies or non-conductive adhesives (NCA). DuPont Kapton substrate, Aerosol Jet nanoparticle silver ink and two types of NCAs were used. The aim of the research is to create a reliable interconnection for&#x...

Steiner, František , Wirth, Václav , Hirman, Martin
Relationship of soldering profile, voids, formation and strength of soldered joints

This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion A...

Pavec, Martin , Hirman, Martin , Soukup, Radek , Hamáček, Aleš
The testing of brass solderability for hybrid sewing thread

This paper presents a research focused on testing of brass solderability for hybrid sewing thread. The hybrid sewing thread is composed of two strands each containing 48 polyester (PES) fibers and 4 brass micro wires. As main investigative method was chosen spread test. Due to...

Michal, David , Suchý, Stanislav , Šlauf, Josef , Řeboun, Jan , Soukup, Radek
Resistance welding in smart textile

With the growing Smart Textile industry, there is currently increasing interest in mapping the possibilities and quality of contacting embroidered conductive patterns. This paper deals with one of the contacting options currently in use, the method of resistance welding. Furthermore, the pap...

Kalčík, Jan , Soukup, Radek
Large area temperature measurement in smart textiles

Smart firefighter protective suits can monitor their inner and outer temperature in order to prevent the burning of sensitive human skin. Embroidered large area sensors, which were developed at the University of West Bohemia in cooperation with industrial partners, are ideal for this&#x...

Hirman, Martin , Navrátil, Jiří , Steiner, František , Hamáček, Aleš
Reliability of glued joints on flexible substrates during accelerated current ageing

This paper deals with reliability of joints glued by non-conductive adhesives (NCA) on flexible substrates during electrical current ageing. Also the comparison of NCA joints ageing with ECA joints ageing is presented in this paper. Two types of adhesives were used for the experime...

Pavec, Martin , Navrátil, Jiří , Soukup, Radek , Smítka, Václav , Hamáček, Aleš
Fully printed IoT antenna for drone-deployed autonomous sensor unit

This paper presents research focused on the development of a flexible fully printed IoT antenna for a drone-deployed autonomous sensor unit optimized for IoT applications. Aerosol Jet® was chosen as manufacturing technology. DuPont™ Kapton® HN 500 polyimide foil was used as a substrate....

Hlína, Jiří , Řeboun, Jan , Hamáček, Aleš
Properties of thick printed copper films on alumina substrates

This paper is focused on the properties of Thick Printed Copper (TPC) films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The th...

Collection's Items (Sorted by Submit Date in Descending order): 1 to 20 of 51