Title:	Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Authors:	Hirman, Martin Navrátil, Jiří Steiner, František Džugan, Tomáš Hamáček, Aleš
Citation:	HIRMAN, M., NAVRÁTIL, J., STEINER, F., DŽUGAN, T., HAMÁČEK, A. Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate. Journal of Materials Science: Materials in Electronics, 2019, roč. 30, č. 15, s. 14214-14223. ISSN 0957-4522.
Issue Date:	2019
Publisher:	Springer
Document type:	článek article
URI:	2-s2.0-85068867587 http://hdl.handle.net/11025/34939
ISSN:	0957-4522
Keywords in different language:	alternative technologies;chip component;electrically conductive adhesives;flexible substrate;non-conductive adhesives;Uv adhesives;UV curable
Abstract in different language:	This article deals with the assembly of SMD chip components onto a flexible substrate by using non-conductive adhesives. In the experiments, two electrically conductive adhesives (ECA) and two non-conductive adhesives (NCA) were used. The verification of the properties and usability of NCAs for connecting the components to the flexible substrates as an alternative for ECA was the main goal of the experiment. The results show that NCAs can be used as an alternative for ECAs and that the properties and reliability of NCA joints are comparable or better than ECA joints. The results also show that UV-curable NCAs can be recommended for the applications of attaching the components on flexible substrates, especially for the prototypes, where the application of the UV adhesive and the connection of components by this technology is much easier and faster than with ECA.
Rights:	Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © Springer
Appears in Collections:	Články / Articles (KET) Články / Articles (RICE) OBD

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