Název:	Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution
Autoři:	Sorokina, Kristina Bušek, David Dušek, Karel
Citace zdrojového dokumentu:	Electroscope. 2019, č. 2.
Datum vydání:	2019
Nakladatel:	Západočeská univerzita v Plzni, Fakulta elektrotechnická
Typ dokumentu:	článek article
URI:	http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c16.pdf http://hdl.handle.net/11025/36515
ISSN:	1802-4564
Klíčová slova:	roztok NaCl;kapka vody;elektrochemická migrace;bezolovnaté pájky
Klíčová slova v dalším jazyce:	NaCl solution;water drop;electrochemical migration;lead-free solders
Abstrakt v dalším jazyce:	In this article, the electrochemical migration of lead-free solders and electrically conductive adhesives with an Ag content of more than 70% was studied by using a water drop test in NaCl solution. The results of solder pastes were compared with the results of electrically conductive adhesives. It was found that some solder pastes with a low Ag content have a lower susceptibility to electrochemical migration than, for example, solder paste Sn42Bi58. The highest resistance to corrosion has a conductive adhesive CRM-1033B with an Ag content of 75%. Resistance and voltage during the water drop test. From the measured values, it was determined that the values of resistance and voltage decrease with dendrite growing. X-ray spectroscopy was also performed to determine the chemical elemental composition of dendrites. It was found that the dominant element of the dendrite of solder pastes was Sn. In the case of electrically conductive adhesives, Ag was the main element of the dendrite.
Práva:	Copyright © 2019 Electroscope. All Rights Reserved.
Vyskytuje se v kolekcích:	Číslo 2 (2019) Číslo 2 (2019)

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