| Title: | Improvement of thick printed copper substrates solderability by formic acid |
| Authors: | Michal, D. Hirman, M. Řeboun, J. |
| Citation: | Electroscope. 2019, č. 2. |
| Issue Date: | 2019 |
| Publisher: | Západočeská univerzita v Plzni, Fakulta elektrotechnická |
| Document type: | článek article |
| URI: | http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c7.pdf http://hdl.handle.net/11025/36525 |
| ISSN: | 1802-4564 |
| Keywords: | pájitelnost;užití par kyseliny mravenčí;technologie vakuového pájení;keramických substrátech s měděným motivem;keramické substráty s měděným motivem |
| Keywords in different language: | solderability;using formic acid vapours;vacuum soldering technology;thick printed copper substrates |
| Abstract in different language: | This paper deals with solderability of thick printed copper substrates using formic acid vapours in combination with vacuum soldering technology. The topic of low void, preferably void free joints in the field of electronics is important, because of rising demand in high-power applications. Void presence can cause many negative effects such as localized overheating or mechanical stress vulnerability which can result into cracks and splits. If the joints are partially or fully destroyed, the product is non-functional and can lead to its total destruction. This condition can result even in life threatening situation. |
| Rights: | Copyright © 2019 Electroscope. All Rights Reserved. |
| Appears in Collections: | Číslo 2 (2019) Číslo 2 (2019) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Michal.pdf | Plný text | 301,66 kB | Adobe PDF | View/Open |
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