Title: Relationship of soldering profile, voids, formation and strength of soldered joints
Authors: Steiner, František
Wirth, Václav
Hirman, Martin
Citation: STEINER, F., WIRTH, V., HIRMAN, M. Relationship of soldering profile, voids, formation and strength of soldered joints. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-6. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.
Issue Date: 2019
Publisher: IEEE
Document type: konferenční příspěvek
conferenceObject
URI: 2-s2.0-85072284201
http://hdl.handle.net/11025/36562
ISBN: 978-1-7281-1874-1
ISSN: 2161-2528
Keywords in different language: void;solder joint;soldering profile;mechanical strength
Abstract in different language: This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion Ag, immersion Sn) were used. Chip resistors 1206 were soldered by different soldering profile. The soldered joints were observed by X-ray and the void areas were calculated. The mechanical strength of the joints was measured after that. From the results, it is possible to find out the influence of surface finishes, soldering profiles or solder alloys on the formation of voids (area) and on the mechanical strength of joints.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
� IEEE
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)
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