Title: Reliability of glued SMD components on smart textile
Authors: Hirman, Martin
Navrátil, Jiří
Steiner, František
Hamáček, Aleš
Citation: HIRMAN, M. NAVRÁTIL, J. STEINER, F. HAMÁČEK, A. Reliability of glued SMD components on smart textile. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscaway: IEEE, 2020. s. 1-6. ISBN 978-1-72816-773-2.
Issue Date: 2020
Publisher: IEEE
Document type: konferenční příspěvek
URI: 2-s2.0-85087615667
ISBN: 978-1-72816-773-2
Keywords in different language: ageing;conductive adhesives;electrical conductivity;electrical resistivity;reliability;surface mount technology;textile products
Abstract in different language: The paper deals with temperature ageing reliability of joints glued by non-conductive adhesive (NCA) onto the conductive ribbon. The samples prepared with NCA were accelerated aged at 85°C temperature for 1000 hours. The samples were also stretched on 150% of their relaxed length during the ageing. The main aim of the experiment was to verify the possibility of NCA using to make a conductive connection of components onto the ribbon. The joints electrical resistance was measured before, during and after ageing. The results show that using this technology for standard use of ribbons is suitable and reliable.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům
Appears in Collections:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/42804

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