Full metadata record
| DC pole | Hodnota | Jazyk |
|---|---|---|
| dc.contributor.author | Hirman, Martin | |
| dc.contributor.author | Navrátil, Jiří | |
| dc.contributor.author | Steiner, František | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2021-03-08T11:00:20Z | - |
| dc.date.available | 2021-03-08T11:00:20Z | - |
| dc.date.issued | 2020 | |
| dc.identifier.citation | HIRMAN, M. NAVRÁTIL, J. STEINER, F. HAMÁČEK, A. Electrical resistance of solder joints on conductive ribbons. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscaway: IEEE, 2020. s. 1-5. ISBN 978-1-72816-773-2. | cs |
| dc.identifier.isbn | 978-1-72816-773-2 | |
| dc.identifier.uri | 2-s2.0-85087616990 | |
| dc.identifier.uri | http://hdl.handle.net/11025/42805 | |
| dc.format | 5 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en | en |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020 | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © IEEE | en |
| dc.title | Electrical resistance of solder joints on conductive ribbons | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.rights.access | restrictedAccess | en |
| dc.type.version | publishedVersion | en |
| dc.description.abstract-translated | The paper deals with high humidity and high temperature ageing reliability of joints soldered / glued by non-conductive adhesive (NCA) onto the conductive ribbon. The prepared samples were accelerated aged at 85°C temperature and 85% RH for 1000 hours. The main goal of the experiment was to verify the possibility of using soldering to make a conductive connection of components onto the ribbon. The joints electrical resistance was measured before, during and after ageing. The results show that using of soldering to ensure the conductive connection of components onto the ribbons is suitable and reliable. Also the using of non-conductive adhesive for this connection can be possible, but this option should be more tested and a suitable temperature limit should be found. | en |
| dc.subject.translated | adhesives | en |
| dc.subject.translated | ageing | en |
| dc.subject.translated | conductive adhesives | en |
| dc.subject.translated | electrical resistivity | en |
| dc.subject.translated | reliability | en |
| dc.subject.translated | solders | en |
| dc.subject.translated | tin alloys | en |
| dc.identifier.doi | 10.1109/ISSE49702.2020.9120981 | |
| dc.type.status | Peer-reviewed | en |
| dc.identifier.obd | 43929900 | |
| dc.project.ID | EF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligence | cs |
| dc.project.ID | SGS-2018-016/Diagnostika a materiály v elektrotechnice | cs |
| Vyskytuje se v kolekcích: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) Konferenční příspěvky / Conference papers (KET) OBD | |
Soubory připojené k záznamu:
| Soubor | Velikost | Formát | |
|---|---|---|---|
| Hirman_C05_PAPER.pdf | 1,11 MB | Adobe PDF | Zobrazit/otevřít Vyžádat kopii |
Použijte tento identifikátor k citaci nebo jako odkaz na tento záznam:
http://hdl.handle.net/11025/42805Všechny záznamy v DSpace jsou chráněny autorskými právy, všechna práva vyhrazena.