Full metadata record
DC FieldValueLanguage
dc.contributor.authorKadlec, Petr
dc.contributor.authorPihera, Josef
dc.contributor.authorProsr, Pavel
dc.contributor.authorPolanský, Radek
dc.date.accessioned2022-03-14T11:00:24Z-
dc.date.available2022-03-14T11:00:24Z-
dc.date.issued2021
dc.identifier.citationKADLEC, P. PIHERA, J. PROSR, P. POLANSKÝ, R. Dielectric analysis of selected polyimide films and derived epoxy-based sandwich composites. In Proceedings of the 39th Electrical Insulation Conference. Piscaway: IEEE, 2021. s. 416-419. ISBN: 978-1-66541-564-4cs
dc.identifier.isbn978-1-66541-564-4
dc.identifier.uri2-s2.0-85123351767
dc.identifier.urihttp://hdl.handle.net/11025/47144
dc.format4 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseriesProceedings of the 39th Electrical Insulation Conferenceen
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.titleDielectric analysis of selected polyimide films and derived epoxy-based sandwich compositesen
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedComposites with the epoxy matrix are still the most common composites used in high voltage electrical insulation systems. Polyimides are materials with excellent heat resistance and high electrical strength for application, where high overall endurance and reliability even under harsh operating conditions is needed. Polymer composites with very good dielectric parameters may be composed of base polymer composite and additional dielectric barrier. The combination of the polyimide film and the epoxy-based composite, e.g., in the form of a prepreg, leading to the formation of a multicomponent sandwich composite, is relatively simple and the resulting material properties can be very advantageous. However, the detailed analysis of polyimide films is necessary for a suitable oversizing of the mentioned composites. The study of selected dielectric properties, e.g., volume resistivity, permittivity, and dissipation factor, of several types of polyimides, are presented in this contribution in the first step. Epoxy resin without filler was also analyzed as a base material for the tested composite. Two-component composites (epoxy resin with polyimide film) as a fundamental variant of the mentioned multicomponent sandwich composite were tested in the second step. The results show the impact of polyimide type on the final composite properties from the dielectric point of view. The polyimides incorporated in the composite generally decrease the volume resistivity but increase the dielectric strength.en
dc.subject.translateddissipation factoren
dc.subject.translatedpolyimidesen
dc.subject.translatedsandwich compositesen
dc.subject.translatedvolume resistivityen
dc.subject.translatedpermittivityen
dc.identifier.doi10.1109/EIC49891.2021.9612336
dc.type.statusPeer-revieweden
dc.identifier.obd43934254
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
Appears in Collections:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
OBD

Files in This Item:
File SizeFormat 
Kadlec_Dielectric.pdf657,54 kBAdobe PDFView/Open    Request a copy
Show simple item record


Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/47144

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

search
navigation
  1. DSpace at University of West Bohemia
  2. Publikační činnost / Publications
  3. OBD