| Title: | SIMCENTER, engineering complex products from Siemens PLM Software for electronic cooling |
| Authors: | Trubelová, Šárka |
| Citation: | Electroscope. 2018, č. 1. |
| Issue Date: | 2018 |
| Publisher: | Západočeská univerzita v Plzni, Fakulta elektrotechnická |
| Document type: | článek article |
| URI: | http://147.228.94.30/images/PDF/Rocnik2018/Cislo1_2018/r12c1c8.pdf http://hdl.handle.net/11025/31003 |
| ISSN: | 1802-4564 |
| Keywords: | elektronická zařízení;elektronické chlazení;chytrá technologie;SimcenterTM |
| Keywords in different language: | electronic devices;electronic cooling;smart technology;SimcenterTM |
| Abstract in different language: | For electronic devices, temperature is a limiting factor. Packing technology, driven by constant consumer demand and competitive pressure, allows higher power density than current cooling technology can handle. Sustained elevated temperatures act to not only reduce component efficiency, but also to reduce product life. We present a unique platform SimcenterTM that enables predictive engineering analytics by bringing a strong alignment between 1D simulation and 3D computer-aided engineering (CAE). |
| Rights: | Copyright © 2018 Electroscope. All Rights Reserved. |
| Appears in Collections: | Číslo 1 (2018) Číslo 1 (2018) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| r12c1c9.pdf | Plný text | 549,77 kB | Adobe PDF | View/Open |
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