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Results 1-10 of 14 (Search time: 0.003 seconds).
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Issue DateTitleAuthor(s)
2019Study of co-fired multilayer structures based on Thick Printed Copper technologyHlína, Jiří; Řeboun, Jan; Heřmanský, Vojtěch; Šimonovský, Marek; Johan, Jan; Hamáček, Aleš
2020Study of copper thick film metallization on aluminum nitrideHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2019Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrateHirman, Martin; Navrátil, Jiří; Steiner, František; Džugan, Tomáš; Hamáček, Aleš
2019Optimization of the photodynamic inactivation of prions by a phthalocyanine photosensitizer: The crucial involvement of singlet oxygenKostelanská, Marie; Freisleben, Jaroslav; Bačkovská Hanusová, Zdeňka; Moško, Tibor; Vik, Robert; Moravcová, Daniela; Hamáček, Aleš; Mosinger, Jiří; Holada, Karel
2019Reliability of printed power resistor with thick-film copper terminalsHlína, Jiří; Řeboun, Jan; Johan, Jan; Šimonovský, Marek; Hamáček, Aleš
2019Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrateHirman, Martin; Steiner, František; Navrátil, Jiří; Hamáček, Aleš
2019Temperature modulated field effect in organic electrochemical transistor with ionic liquidsMaračková, Lucie; Pospíšil, Jan; Mraček, Lukáš; Syrový, Tomáš; Hamáček, Aleš; Zmeškal, Oldřich
2019Reliability of glued joints on flexible substrates during accelerated current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2019Advanced application capabilities of thick printed copper technologyHlína, Jiří; Řeboun, Jan; Johan, Jan; Hamáček, Aleš
2019The testing of brass solderability for hybrid sewing threadPavec, Martin; Hirman, Martin; Soukup, Radek; Hamáček, Aleš