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Fakulta elektrotechnická / Faculty of Electrical Engineering
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Author(s)
2020
Copper-filled vias made by thick printed copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Michal, David
;
Hamáček, Aleš
2020
Interconnection of terminals on flexible substrates with printed conductive patterns
Řeboun, Jan
;
Kalaš, David
;
Michal, David
;
Hlína, Jiří
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Hamáček, Aleš
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Kalaš, David
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ageing
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contact resistance
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copper
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copper alloys
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conferenceObject
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2020