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Issue Date
Title
Author(s)
2019
Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Džugan, Tomáš
;
Hamáček, Aleš
2019
Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Hirman, Martin
;
Steiner, František
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Author
1
Džugan, Tomáš
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Hamáček, Aleš
1
Navrátil, Jiří
Subject
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alternative technologies
1
chip component
1
electrically conductive adhesive
1
electrically conductive adhesives
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2
article
Date issued
2
2019