Title: Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Authors: Hirman, Martin
Steiner, František
Citation: HIRMAN, M., STEINER, F. Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs. Electroscope, 2019, roč. 2019, č. 2, s. 1-6. ISSN 1802-4564.
Issue Date: 2019
Publisher: Západočeská univerzita v Plzni
Document type: článek
article
URI: http://hdl.handle.net/11025/36648
ISSN: 1802-4564
Keywords in different language: stencil printing;stencil aperture;electrically conductive adhesive;printing optimization
Abstract in different language: This paper deals with the influence of different apertures shape in stencil on mechanical shear strength, electrical resistance and insulation distance. In the experiment, the SMD chip components 0805 were assembled on flexible substrate by electrically conductive adhesives (MG 8331S, CA 3150). Six different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. The half of samples was measured directly (electrical resistance, mechanical strength and insulation distance) and second half of samples was submitted to the accelerated ageing test (85°C/85%RH/16hrs) and then tested the same way. The results shows that it is appropriate to choose other aperture shape in stencil than standard rectangular shape.
Rights: © Západočeská univerzita
Appears in Collections:Články / Articles (RICE)
Články / Articles (KET)
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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/36648

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