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dc.contributor.authorPulec, Jiří
dc.contributor.authorSzendiuch, Ivan
dc.date.accessioned2013-05-07T12:16:00Z
dc.date.available2013-05-07T12:16:00Z
dc.date.issued2013
dc.identifier.citationElectroscope. 2013, č. 1.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2013/Cislo1_2013/r6c6c1.pdf
dc.identifier.urihttp://hdl.handle.net/11025/1884
dc.format4 s.
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rights© 2013 Electroscope. All rights reserved.en
dc.subjectfrekvenční filtrcs
dc.subjecttlusté vrstvycs
dc.titleFrequency bandpass filter in hybrid thick film technologyen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedIn current electronics technology, important devices are frequency filters. These devices are used in many applications, mostly in communication technology, e.g. splitters, ADSL modems etc. In technology of manufacturing of these devices, mostly the discrete components soldered on main substrate, mostly its components are realized in SMD. This is good solution for commercial field, because this technology is well known. For industrial and military and industrial, high reliability is required. This article describes the design of planar frequency bandpass filter and results of its testing. The attention is devoted to the differences between the device theoretically designed and the device which was actually realized.en
dc.subject.translatedfrequency filteren
dc.subject.translatedthick filmsen
dc.type.statusPeer-revieweden
Appears in Collections:Číslo 1 (2013)
Číslo 1 (2013)

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