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Fakulta elektrotechnická / Faculty of Electrical Engineering
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Issue Date
Title
Author(s)
2019
Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Džugan, Tomáš
;
Hamáček, Aleš
2019
Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Hirman, Martin
;
Steiner, František
2020
Comparison of conductive ribbons reliability during electrical current ageing
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Hamáček, Aleš
2019
Relationship of soldering profile, voids, formation and strength of soldered joints
Steiner, František
;
Wirth, Václav
;
Hirman, Martin
2020
The role of process management in the context of industry 4.0
Švehla, Michal
;
Řeřicha, Tomáš
;
Tupa, Jiří
;
Steiner, František
2019
Requirements for education 4.0 and study programs within industry 4.0
Benešová, Andrea
;
Hirman, Martin
;
Steiner, František
;
Tupa, Jiří
2019
Bend testing of SMD chip resistors glued on flexible substrates
Hirman, Martin
;
Neuhöfer, Tomáš
;
Steiner, František
2019
Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate
Hirman, Martin
;
Steiner, František
;
Navrátil, Jiří
;
Hamáček, Aleš
2019
Project management during the industry 4.0 implementation with risk factor analysis
Hirman, Martin
;
Benešová, Andrea
;
Steiner, František
;
Tupa, Jiří
2019
Industry 4.0 and business process management
Tupa, Jiří
;
Steiner, František
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Authors
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Keywords
Type
Author
21
Hirman, Martin
10
Navrátil, Jiří
9
Hamáček, Aleš
8
Tupa, Jiří
.
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Subject
6
industry 4.0
5
non-conductive adhesive
4
reliability
3
ageing
.
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Type
20
konferenční příspěvek
15
conferenceObject
5
ConferenceObject
4
article
.
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Date issued
4
2022
2
2021
8
2020
10
2019
.
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