Název: | Sintering of printed Ag on ceramic substrates with the use of formic acid |
Autoři: | Michal, David Janda, Martin Řeboun, Jan |
Citace zdrojového dokumentu: | MICHAL, D. JANDA, M. ŘEBOUN, J. Sintering of printed Ag on ceramic substrates with the use of formic acid. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7 |
Datum vydání: | 2021 |
Nakladatel: | IEEE |
Typ dokumentu: | konferenční příspěvek ConferenceObject |
URI: | 2-s2.0-85113983389 http://hdl.handle.net/11025/49725 |
ISBN: | 978-1-66541-477-7 |
Klíčová slova v dalším jazyce: | printed electronics;pressureless sintering;formic acid vapours;silver-based paste |
Abstrakt: | This paper deals with joints creation on ceramic substrates with printed conductive patterns made from copper and silver. Sintering on the printed patterns is extremely specific because of porous structure, big grains, and glassy phase. Joints are created using pressureless sintering technology with silver-based nanoparticle paste and its sintering occurred in various atmosphere settings, using the air, formic acid or with the combination of both. Sintering is the most promising die-attach technique for power electronic devices. Presented paper deals with the process of sintering on the printed patterns, including deposition of the sintering paste, selecting, and defining correct temperature profiles. Different pre-process cleaning procedures were also applied. For evaluation, shear test showing mechanical strength and also x-ray images for advanced analysis of internal structure were used. |
Abstrakt v dalším jazyce: | This paper deals with joints creation on ceramic substrates with printed conductive patterns made from copper and silver. Sintering on the printed patterns is extremely specific because of porous structure, big grains, and glassy phase. Joints are created using pressureless sintering technology with silver-based nanoparticle paste and its sintering occurred in various atmosphere settings, using the air, formic acid or with the combination of both. Sintering is the most promising die-attach technique for power electronic devices. Presented paper deals with the process of sintering on the printed patterns, including deposition of the sintering paste, selecting, and defining correct temperature profiles. Different pre-process cleaning procedures were also applied. For evaluation, shear test showing mechanical strength and also x-ray images for advanced analysis of internal structure were used. |
Práva: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
Vyskytuje se v kolekcích: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD |
Soubory připojené k záznamu:
Soubor | Velikost | Formát | |
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Michal_09467610.pdf | 6,93 MB | Adobe PDF | Zobrazit/otevřít Vyžádat kopii |
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http://hdl.handle.net/11025/49725
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