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dc.contributor.authorSteiner, František
dc.contributor.authorHirman, Martin
dc.contributor.authorProsr, Pavel
dc.contributor.authorRous, Pavel
dc.date.accessioned2022-10-17T10:02:22Z-
dc.date.available2022-10-17T10:02:22Z-
dc.date.issued2021
dc.identifier.citationSTEINER, F. HIRMAN, M. PROSR, P. ROUS, P. Properties verification of improved lead-free solder alloys. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7cs
dc.identifier.isbn978-1-66541-477-7
dc.identifier.uri2-s2.0-85113955001
dc.identifier.urihttp://hdl.handle.net/11025/49728
dc.description.abstractThis article presents research focused on the reliability of soldered joints. The quality of solder joints is formed already during the soldering process. The first parameter that determines the quality of the connection is solderability. Good solderability is essential for the subsequent reliability of the joint. The second parameter, which affects reliability and is also determined during the soldering process, is the thickness of intermetallic compounds. However, this parameter is also affected by the operating conditions. It increases over time. These two parameters were selected for our experiment. The object of the experiment is to compare the standard lead-free solder alloy SAC 305 with solders that have been enriched with cobalt or germanium. The comparison and full results from measurement will be discussed in the full paper.en
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseries2021 44th International Spring Seminar on Electronics Technology : /proceedings/en
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.titleProperties verification of improved lead-free solder alloysen
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis article presents research focused on the reliability of soldered joints. The quality of solder joints is formed already during the soldering process. The first parameter that determines the quality of the connection is solderability. Good solderability is essential for the subsequent reliability of the joint. The second parameter, which affects reliability and is also determined during the soldering process, is the thickness of intermetallic compounds. However, this parameter is also affected by the operating conditions. It increases over time. These two parameters were selected for our experiment. The object of the experiment is to compare the standard lead-free solder alloy SAC 305 with solders that have been enriched with cobalt or germanium. The comparison and full results from measurement will be discussed in the full paper.en
dc.subject.translatedwetting balance testen
dc.subject.translatedwetting forceen
dc.subject.translatedintermetallic compound (IMC)en
dc.subject.translatedlead-free solderen
dc.subject.translatedsolder jointen
dc.identifier.doi10.1109/ISSE51996.2021.9467573
dc.type.statusPeer-revieweden
dc.identifier.document-number853459100027
dc.identifier.obd43933020
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
Vyskytuje se v kolekcích:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
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