Full metadata record
| DC pole | Hodnota | Jazyk |
|---|---|---|
| dc.contributor.author | Livovský, Ľubomír | |
| dc.contributor.author | Pietriková, Alena | |
| dc.contributor.editor | Pihera, Josef | |
| dc.contributor.editor | Steiner, František | |
| dc.date.accessioned | 2012-10-17T08:46:50Z | |
| dc.date.available | 2012-10-17T08:46:50Z | |
| dc.date.issued | 2009 | |
| dc.identifier.citation | Electroscope. 2009, č. 2, výběr z konference Diagnostika. | cs |
| dc.identifier.issn | 1802-4564 | |
| dc.identifier.uri | http://147.228.94.30/images/PDF/Rocnik2009/cislo2_2009_Diagnostika/r3c2c1.pdf | |
| dc.identifier.uri | http://hdl.handle.net/11025/543 | |
| dc.format | 4 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | sk | sk |
| dc.publisher | Západočeská univerzita v Plzni, Fakulta elektrotechnická | cs |
| dc.relation.ispartofseries | Electroscope | cs |
| dc.rights | Copyright © 2007-2010 Electroscope. All Rights Reserved. | en |
| dc.subject | nasycená pára | cs |
| dc.subject | měření teplotního profilu | cs |
| dc.subject | desky plošných spojů | cs |
| dc.title | Meranie teplotného profilu v prostredí nasýtených pár | sk |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.rights.access | openAccess | en |
| dc.type.version | publishedVersion | en |
| dc.description.abstract-translated | The process of soldering has to guarantee suitable temperature conditions for formation of metallurgical joint between leads of components and conductive pads on printed circuit board. The formation of reliable and quality joint depends on temperature profile, which guarantees transformation of solid alloy into “molten metal” and consecutive reformation of solid alloy. The alloy finally acts a conductive joint. The process is controlled by the temperature profile, which defines temperature change vs. time. The temperature profile is specified to form reliable joint. Recommendations for measurement of the temperature profile are presented in IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". The recommendations in IPC-7530 for mass soldering assume application of solder wave or reflow oven (solder paste reflow). This article is aimed at obtaining experience with solder paste reflow in developed machine, which works on principleof saturated vapours condensation (VPS - Vapour Phase Soldering). | en |
| dc.subject.translated | printed circuit boards | en |
| dc.subject.translated | temperature profile measurement | en |
| dc.subject.translated | saturated steam | en |
| dc.type.status | Peer-reviewed | en |
| Vyskytuje se v kolekcích: | Číslo 2 - výběr z konference Diagnostika (2009) Číslo 2 - výběr z konference Diagnostika (2009) | |
Soubory připojené k záznamu:
| Soubor | Popis | Velikost | Formát | |
|---|---|---|---|---|
| r3c2c1.pdf | 402,96 kB | Adobe PDF | Zobrazit/otevřít |
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