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dc.contributor.authorKlíma, Martin
dc.contributor.authorPsota, Boleslav
dc.contributor.authorSzendiuch, Ivan
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2013-12-18T07:50:35Z
dc.date.available2013-12-18T07:50:35Z
dc.date.issued2013
dc.identifier.citationElectroscope. 2013, č. 5, EEICT + EDS.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2013/Cislo5_2013/r7c5c4.pdf
dc.identifier.urihttp://hdl.handle.net/11025/6616
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rights© 2013 Electroscope. All rights reserved.en
dc.subjectmikrodrátkové spojecs
dc.subjectkeramika s nízkou teplotou výpalucs
dc.subjectzkoušení materiálucs
dc.titleWire-bonds Durability in High-temperature Applicationsen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thi ck film technology in applications with semiconductors base d on SiC and GaN, which have high operating tempera ture. Especially, Heraeus HeraLock 2000 substrate is inve stigated. The paper is mainly focused on the behavi our and reliability of wire-bonds, which are used for conne ction of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal lo ad. Subsequently, changes in the bonds resistivity were studied, together with their strength and any defe cts caused by the thermal load. Other properties, such as term omechanical stress of the material for different te mperature profiles were simulated in the ANSYS software. Crea ted mathematical model simulated and compared differences between gold and aluminium wire-bond.en
dc.subject.translatedwire-bondsen
dc.subject.translatedow-temperature co-fired ceramicsen
dc.subject.translatedmaterial testingen
dc.type.statusPeer-revieweden
Appears in Collections:Číslo 5 (2013)
Číslo 5 (2013)

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