Title: Comparison of Rosin Fluxes
Authors: Rendl, Karel
Macháč, Jan
Steiner, František
Wirth, Václav
Citation: Electroscope. 2013, č. 5, EEICT + EDS.
Issue Date: 2013
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
ISSN: 1802-4564
Keywords: kalafunová tavidla;pájitelnost;testování materiálu
Keywords in different language: rosin fluxes;solderability;material testing
Abstract in different language: This article will present results of activity testing of rosin fluxes. A good solderability of a component output and a soldering pad of PCB are important for the creation of a quality joint. Since it supports a melted solder wetting on a soldered surface, a flux has a definitive influence on the creation of a quality joint. Further, it removes oxides and other impurities from soldering alloys and prevents from a creation of a new oxide layer during soldering. According the technology of a solder joint creation, a flux is added into the soldering process in different ways. The aim of the test was to select a rosin flux having with the solder tube the best results during soldering of the copper surface on PCB's. Fluxes were compared by the help of two different tests. The first trial was carried out by the area of spread method, since this test is suitable for solderability testing of materials and comparison of a flux activity. The wetting balance test was chosen as the second trial. This method enables to measure the wetting force affecting the tested sample. Curves of wetting forces are the test result serving for comparison of single fluxes.
Rights: © 2013 Electroscope. All rights reserved.
Appears in Collections:Číslo 5 (2013)
Číslo 5 (2013)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/6623

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