Title:	Study of co-fired multilayer structures based on Thick Printed Copper technology
Authors:	Hlína, Jiří Řeboun, Jan Heřmanský, Vojtěch Šimonovský, Marek Johan, Jan Hamáček, Aleš
Citation:	HLÍNA, J., ŘEBOUN, J., HEŘMANSKÝ, V., ŠIMONOVSKÝ, M., JOHAN, J., HAMÁČEK, A. Study of co-fired multilayer structures based on Thick Printed Copper technology. Materials Letters, 2019, roč. 238, č. 1 March, s. 313-316. ISSN 0167-577X.
Issue Date:	2019
Publisher:	Elsevier
Document type:	článek article
URI:	2-s2.0-85058782319 http://hdl.handle.net/11025/30931
ISSN:	0167-577X
Keywords in different language:	ceramics;deposition;electrical properties;thick films;dielectrics;multilayer structures
Abstract in different language:	This paper is focused on the study of co-fired multilayer structures realized by Thick Printed Copper (TPC) technology. TPC technology is used for the manufacturing of substrates for power applications and it enables simple manufacturing of multilayer structures. These structures usually consist of two copper films separated by a dielectric film which are commonly fired individually. Co-firing of these films can reduce production costs and time. It does not deteriorate electrical parameters. The influence of co-firing of different film combinations on the inner structure, electrical and mechanical parameters and also the changes of these parameters after aging and thermal cycling are described in this paper.
Rights:	Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © Elsevier
Appears in Collections:	Články / Articles (RICE) OBD

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.