Title: Influence of electrically conductive adhesive amount on shear strength of glued joints
Authors: Steiner, František
Hirman, Martin
Citation: 2015 International Conference on Applied Electronics: Pilsen, 8th – 9th September 2015, Czech Republic, p.53-56.
Issue Date: 2015
Publisher: Západočeská univerzita v Plzni
Document type: konferenční příspěvek
URI: http://hdl.handle.net/11025/35093
ISBN: 978-80-261-0385-1 (Print)
978-80-261-0386-8 (Online)
ISSN: 1805-9597 (Online)
978-80-261-0385-1 (Print)
Keywords: vodivá lepidla;léčení;klouby;síla;odpor;kovy;měření polovodičových zařízení
Keywords in different language: conductive adhesives;curing;joints;force;resistors;metal;semiconductor device measurement
Abstract in different language: This paper deals with the influence of electrically conductive adhesive amount on shear strength of joints glued by EPO-TEK® H20S and MG 8331S. These joints were made by gluing of chip resistors 1206, 0805 and 0603 with two curing profiles for each adhesive. The different thickness of stencils and reductions of the hole in stencils were used. These differences have an effect on the amount of conductive adhesives on the samples. The curing profiles and various amounts of the adhesives have an effect on the mechanical strength of the joint. Samples were measured after curing process by using shear strength test with the device LabTest 3.030.
Rights: © University of West Bohemia
Appears in Collections:Články / Articles (KAE)
Applied Electronics 2015
Applied Electronics 2015

Files in This Item:
File Description SizeFormat 
Hirman.pdfPlný text385,59 kBAdobe PDFView/Open

Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/35093

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.