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DC poleHodnotaJazyk
dc.contributor.authorRochala, Patrick
dc.contributor.authorHofmann, Christian
dc.contributor.authorKroll, Martin
dc.contributor.authorWiemer, Maik
dc.contributor.authorKräusel, Verena
dc.date.accessioned2021-11-12T06:38:22Z
dc.date.available2021-11-12T06:38:22Z
dc.date.issued2021
dc.identifier.citationProceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 85-86.en
dc.identifier.isbn978-80-261-0930-3
dc.identifier.urihttp://hdl.handle.net/11025/45801
dc.format2 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherFaculty of Electrical Engineering, University of West Bohemiaen
dc.rights© IEEEen
dc.subjectindukční vazbacs
dc.subjectbalení na úrovni čipůcs
dc.subjectFE simulacecs
dc.titleChip-level bonding for microelectronic components by induction sintering of micro structured Ag particlesen
dc.typeconferenceObjecten
dc.typekonferenčí příspěvekcs
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedA new induction based sintering process for chip level bonding of power electronics components is presented in which silver particles containing pastes are used as bonding material. Using finite element methods, the bonding process was analyzed and optimized so that efficient sintering of the particles could be achieved in subsequent heating and bonding tests. Therefore, the process has great potential for application in the industrial production of electronic components.en
dc.subject.translatedinduction bondingen
dc.subject.translatedchip-level packagingen
dc.subject.translatedFE simulationen
dc.type.statusPeer-revieweden
Vyskytuje se v kolekcích:UIE 2021
UIE 2021

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  4. Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes
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