Higher Temperature Washing of Electrically Connected SMD Components onto the Textile Ribbons

Abstract

This article addresses the higher temperature washing reliability research of interconnection technique for mounting SMD (surface mounted device) components onto conductive stretchable textile ribbons. It can be concluded that both tested interconnection technologies (i.e. low-temperature soldering and adhesive bonding) have some pros and cons, and both technologies are usable for dedicated applications. The results for soldered samples are better and stable for both tested washing temperatures 60°C and 92°C and are suitable especially for power supply applications or heating. The adhesive bonded joints have acceptable results only for 60°C washing temperature and are suitable for sensors, illumination, data transfer applications, or components with multiple leads. The research also shows that prepared joints have higher endurance than the whole ribbon.