Title: Wire-bonds Durability in High-temperature Applications
Authors: Klíma, Martin
Psota, Boleslav
Szendiuch, Ivan
Citation: Electroscope. 2013, č. 5, EEICT + EDS.
Issue Date: 2013
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
ISSN: 1802-4564
Keywords: mikrodrátkové spoje;keramika s nízkou teplotou výpalu;zkoušení materiálu
Keywords in different language: wire-bonds;ow-temperature co-fired ceramics;material testing
Abstract in different language: This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thi ck film technology in applications with semiconductors base d on SiC and GaN, which have high operating tempera ture. Especially, Heraeus HeraLock 2000 substrate is inve stigated. The paper is mainly focused on the behavi our and reliability of wire-bonds, which are used for conne ction of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal lo ad. Subsequently, changes in the bonds resistivity were studied, together with their strength and any defe cts caused by the thermal load. Other properties, such as term omechanical stress of the material for different te mperature profiles were simulated in the ANSYS software. Crea ted mathematical model simulated and compared differences between gold and aluminium wire-bond.
Rights: © 2013 Electroscope. All rights reserved.
Appears in Collections:Číslo 5 (2013)
Číslo 5 (2013)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/6616

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