Browsing by Author Hirman, Martin

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Issue DateTitleAuthor(s)
2019Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrateHirman, Martin; Navrátil, Jiří; Steiner, František; Džugan, Tomáš; Hamáček, Aleš
2019Bend testing of SMD chip resistors glued on flexible substratesHirman, Martin; Neuhöfer, Tomáš; Steiner, František
2020Comparison of conductive ribbons reliability during electrical current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2019Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrateHirman, Martin; Steiner, František; Navrátil, Jiří; Hamáček, Aleš
2020Design, fabrication and risk assessment of IoT unit for products manufactured in industry 4.0 factoryHirman, Martin; Benešová, Andrea; Šíma, Karel; Steiner, František; Tupa, Jiří
2019Determination of changes in process management within industryBenešová, Andrea; Hirman, Martin; Steiner, František; Tupa, Jiří
2017Diagnostika propojovacích struktur součástek a substrátůHirman, Martin
2020Effect of washing cycles on glued conductive joints used on stretchable smart textile ribbonsHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2020Effects of accelerated climatic aging on volume and surface resistivity of glass fiber reinforced thermoset compositesProsr, Pavel; Polanský, Radek; Pihera, Josef; Kadlec, Petr; Hirman, Martin; Krejnická, Tereza; Musil, Ondřej; Komárek, Josef; Pavlica, Richard
2020Electrical resistance of solder joints on conductive ribbonsHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2015Influence of electrically conductive adhesive amount on shear strength of glued jointsSteiner, František; Hirman, Martin
2020Influence of production and operating conditions on properties of acrylic conformal coatingsSteiner, František; Hirman, Martin; Rous, Pavel; Hornak, Jaroslav
2018Kontaktování SMD součástek na flexibilní DPS s pomocí nevodivých lepidelNavrátil, Jiří; Hirman, Martin
2013Optimalizace skladových procesůHirman, Martin
2019Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBsHirman, Martin; Steiner, František
2020Optimization of contacting technological process on printed conductive pattern for wearable electronicsBenešová, Andrea; Hirman, Martin; Hlína, Jiří; Tupa, Jiří; Steiner, František; Řeboun, Jan
2019Project management during the industry 4.0 implementation with risk factor analysisHirman, Martin; Benešová, Andrea; Steiner, František; Tupa, Jiří
2019Relationship of soldering profile, voids, formation and strength of soldered jointsSteiner, František; Wirth, Václav; Hirman, Martin
2019Reliability of glued joints on flexible substrates during accelerated current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2020Reliability of glued SMD components on smart textileHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš