Title: Usage of inert atmosphere for solderability testing
Authors: Novák, Tomáš
Machač, Jan
Steiner, František
Citation: Electroscope. 2012, č. 6, EDS 2012.
Issue Date: 2012
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
konferenční příspěvek
URI: http://hdl.handle.net/11025/1046
ISSN: 1802-4564
Keywords: testování pájitelnosti;inertní atmosféra;desky plošných spojů
Keywords in different language: solderability testing;inert atmosphere;printed circuit boards
Abstract in different language: The article presents the results of solderability testing of printed circuit boards. The aim of this paper is to compare different atmospheres for solderability testing with different finishes of printed circuit boards (PCB’s). The article contains method descriptions that were used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative copper property is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere does not contain oxygen and prevents oxidation of the material used on PCB’s. The increasingly frequent introduction of inert atmospheres into soldering processes encourages the introduction of a inert atmosphere also in solderability testing processes.
Rights: © 2012 Electroscope. All rights reserved.
Appears in Collections:Číslo 6 - EDS 2012 (2012)
Články / Articles (KET)
Číslo 6 - EDS 2012 (2012)

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