Title: Oxidation of sputtered Cu films during thermal annealing in flowing air
Authors: Šašek, Martin
Zeman, Petr
Musil, Jindřich
Citation: XXVIII International conference on phenomena in ionized gases: July 15-20, 2007, Prague, Czech Republic: proceedings. Praha: Institute of Plasma Physics AS CR, 2007, p. 711-712.
Issue Date: 2007
Publisher: Institute of Plasma Physics AS CR
Document type: konferenční příspěvek
URI: http://icpig2007.ipp.cas.cz/files/download/cd-cko/ICPIG2007/pdf/2P13-24.pdf
ISBN: 978-80-87026-01-4
Keywords: tenké vrstvy;magnetronové naprašování;termogravimetrie;měď;oxidace
Keywords in different language: thin films;magnetron sputtering;thermogravimetry;copper;oxidation
Abstract: The article deals with oxidation of Cu films during post-deposition thermal annealing in flowing air. Cu films were sputtered from a pure Cu target in Ar using dc unbalanced magnetron. The copper oxide films formed during post-deposition thermal annealing were compared with CuOx films sputtered from Cu target in the mixture of Ar and O2. The oxidation behavior of the films was characterized by high-temperature thermogravimetry and X-ray diffraction (XRD). Thermal annealing was carried out in a wide range of temperatures from 300 to 1300°C. It was found that the CuO oxide decomposes into Cu2O+O at ~1040° C.
Rights: © Jindřich Musil, Martin Šašek, Petr Zeman
Appears in Collections:Konferenční příspěvky / Conference Papers (KFY)

Files in This Item:
File Description SizeFormat 
2P13-24.pdf400,34 kBAdobe PDFView/Open

Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/1438

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.