Title: Phase change materials for thermal management of Ic packages
Authors: Fiala, Pavel
Běhunek, Ivo
Steinbauer, Miloslav
Citation: AMTEE ’07 : seventh international conference on Advanced Methods in the Theory of Electrical Engineering : September 10-12, 2007 [Pilsen, Czech Republic].
Issue Date: 2007
Publisher: University of West Bohemia
Document type: konferenční příspěvek
URI: http://amtee.zcu.cz/AMTEE/ArchivedProceedings/proceedings_AMTEE_2007/data/section_i.html
ISBN: 978-80-7043-564-9
Keywords: změna fáze;metoda konečných prvků;teplo;integrovaný obvod
Keywords in different language: phase change;finite element method;heat;integrated circuit
Abstract in different language: This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems.The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.
Rights: © University of West Bohemia
Appears in Collections:CPEE – AMTEE 2007

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