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dc.contributor.authorSkřivan, Jan
dc.contributor.editorFiřt, Jaroslav
dc.date.accessioned2017-11-09T07:38:18Z
dc.date.available2017-11-09T07:38:18Z
dc.date.issued2017
dc.identifier.citationFIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 26. – 27. října 2017. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2017, s. [55-59].cs
dc.identifier.isbn978–80–261–0712–5
dc.identifier.urihttp://hdl.handle.net/11025/26452
dc.format4 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isocscs
dc.publisherZápadočeská univerzita v Plznics
dc.rights© Západočeská univerzita v Plznics
dc.subjectflexibilní elektronikacs
dc.subjectflexibilní podkladcs
dc.subjecttest ohybucs
dc.titleTestování ohebnosti flexibilních elektronických prvků a systémůcs
dc.title.alternativeFlexibility testing of flexible electronic components and systemsen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper is focused on the design and realization of a bend test for flexible electronics. The proposed test method is then verified on the device. For this purpose, samples have been designed and implemented with SMD components connected by three different conductive adhesives. The results of the samples that are measured by four point method are then compared.en
dc.subject.translatedflexible electronicsen
dc.subject.translatedflexible substrateen
dc.subject.translatedbend testen
dc.type.statusPeer-revieweden
Appears in Collections:2017
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