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DC poleHodnotaJazyk
dc.contributor.authorHirman, Martin
dc.contributor.authorNavrátil, Jiří
dc.contributor.authorSteiner, František
dc.contributor.authorDžugan, Tomáš
dc.contributor.authorHamáček, Aleš
dc.date.accessioned2019-09-02T10:00:16Z-
dc.date.available2019-09-02T10:00:16Z-
dc.date.issued2019
dc.identifier.citationHIRMAN, M., NAVRÁTIL, J., STEINER, F., DŽUGAN, T., HAMÁČEK, A. Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate. Journal of Materials Science: Materials in Electronics, 2019, roč. 30, č. 15, s. 14214-14223. ISSN 0957-4522.en
dc.identifier.issn0957-4522
dc.identifier.uri2-s2.0-85068867587
dc.identifier.urihttp://hdl.handle.net/11025/34939
dc.format10 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherSpringeren
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© Springeren
dc.titleAlternative technology for SMD components connection by non‑conductive adhesive on a flexible substrateen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis article deals with the assembly of SMD chip components onto a flexible substrate by using non-conductive adhesives. In the experiments, two electrically conductive adhesives (ECA) and two non-conductive adhesives (NCA) were used. The verification of the properties and usability of NCAs for connecting the components to the flexible substrates as an alternative for ECA was the main goal of the experiment. The results show that NCAs can be used as an alternative for ECAs and that the properties and reliability of NCA joints are comparable or better than ECA joints. The results also show that UV-curable NCAs can be recommended for the applications of attaching the components on flexible substrates, especially for the prototypes, where the application of the UV adhesive and the connection of components by this technology is much easier and faster than with ECA.en
dc.subject.translatedalternative technologiesen
dc.subject.translatedchip componenten
dc.subject.translatedelectrically conductive adhesivesen
dc.subject.translatedflexible substrateen
dc.subject.translatednon-conductive adhesivesen
dc.subject.translatedUv adhesivesen
dc.subject.translatedUV curableen
dc.identifier.doi10.1007/s10854-019-01789-w
dc.type.statusPeer-revieweden
dc.identifier.document-number478863500040
dc.identifier.obd43926588
dc.project.IDSGS-2018-016/Diagnostika a materiály v elektrotechnicecs
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