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dc.contributor.authorHirman, Martin
dc.contributor.authorNeuhöfer, Tomáš
dc.contributor.authorSteiner, František
dc.date.accessioned2020-03-02T11:00:25Z-
dc.date.available2020-03-02T11:00:25Z-
dc.date.issued2019
dc.identifier.citationHIRMAN, M., NEUHÖFER, T., STEINER, F. Bend testing of SMD chip resistors glued on flexible substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-6. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.en
dc.identifier.isbn978-1-7281-1874-1
dc.identifier.issn2161-2528
dc.identifier.uri2-s2.0-85072286275
dc.identifier.urihttp://hdl.handle.net/11025/36557
dc.format6 s.
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseries2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/en
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.titleBend testing of SMD chip resistors glued on flexible substratesen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThe paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton foil with Cu pattern and PET foil with Ag pattern) were used for the experiment. The purpose of the experiment was to achieve reliable joints after the bend testing and compare these joints prepared with different adhesives on different substrates.. The electrical resistance and the mechanical shear strength of the joints were measured before and after the test. Results show that bending of prepared samples is possible without significant changes of properties. Results also show significant influence of substrate type and used adhesive on these properties.en
dc.subject.translatedepoxy adhesiveen
dc.subject.translatedelectrically conductive adhesiveen
dc.subject.translatedbend testingen
dc.subject.translatedflexible substrateen
dc.identifier.doi10.1109/ISSE.2019.8810230
dc.type.statusPeer-revieweden
dc.identifier.document-number507501000022
dc.identifier.obd43926606
dc.project.IDLO1607/RICE-NETESIS - nové technologie a koncepce pro inteligentní průmyslové systémy (NETESIS)cs
dc.project.IDSGS-2018-016/Diagnostika a materi�ly v elektrotechnicecs
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)
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