Full metadata record
| DC pole | Hodnota | Jazyk |
|---|---|---|
| dc.contributor.author | Hirman, Martin | |
| dc.contributor.author | Neuhöfer, Tomáš | |
| dc.contributor.author | Steiner, František | |
| dc.date.accessioned | 2020-03-02T11:00:25Z | - |
| dc.date.available | 2020-03-02T11:00:25Z | - |
| dc.date.issued | 2019 | |
| dc.identifier.citation | HIRMAN, M., NEUHÖFER, T., STEINER, F. Bend testing of SMD chip resistors glued on flexible substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-6. ISBN 978-1-7281-1874-1 , ISSN 2161-2528. | en |
| dc.identifier.isbn | 978-1-7281-1874-1 | |
| dc.identifier.issn | 2161-2528 | |
| dc.identifier.uri | 2-s2.0-85072286275 | |
| dc.identifier.uri | http://hdl.handle.net/11025/36557 | |
| dc.format | 6 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en | en |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/ | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © IEEE | en |
| dc.title | Bend testing of SMD chip resistors glued on flexible substrates | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.rights.access | restrictedAccess | en |
| dc.type.version | publishedVersion | en |
| dc.description.abstract-translated | The paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton foil with Cu pattern and PET foil with Ag pattern) were used for the experiment. The purpose of the experiment was to achieve reliable joints after the bend testing and compare these joints prepared with different adhesives on different substrates.. The electrical resistance and the mechanical shear strength of the joints were measured before and after the test. Results show that bending of prepared samples is possible without significant changes of properties. Results also show significant influence of substrate type and used adhesive on these properties. | en |
| dc.subject.translated | epoxy adhesive | en |
| dc.subject.translated | electrically conductive adhesive | en |
| dc.subject.translated | bend testing | en |
| dc.subject.translated | flexible substrate | en |
| dc.identifier.doi | 10.1109/ISSE.2019.8810230 | |
| dc.type.status | Peer-reviewed | en |
| dc.identifier.document-number | 507501000022 | |
| dc.identifier.obd | 43926606 | |
| dc.project.ID | LO1607/RICE-NETESIS - nové technologie a koncepce pro inteligentní průmyslové systémy (NETESIS) | cs |
| dc.project.ID | SGS-2018-016/Diagnostika a materi�ly v elektrotechnice | cs |
| Vyskytuje se v kolekcích: | Konferenční příspěvky / Conference papers (RICE) Konferenční příspěvky / Conference papers (KET) OBD | |
Soubory připojené k záznamu:
| Soubor | Velikost | Formát | |
|---|---|---|---|
| Hirman_08810230_z IEEE.pdf | 961,99 kB | Adobe PDF | Zobrazit/otevřít Vyžádat kopii |
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