Title: Bend testing of SMD chip resistors glued on flexible substrates
Authors: Hirman, Martin
Neuhöfer, Tomáš
Steiner, František
Citation: HIRMAN, M., NEUHÖFER, T., STEINER, F. Bend testing of SMD chip resistors glued on flexible substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-6. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.
Issue Date: 2019
Publisher: IEEE
Document type: konferenční příspěvek
URI: 2-s2.0-85072286275
ISBN: 978-1-7281-1874-1
ISSN: 2161-2528
Keywords in different language: epoxy adhesive;electrically conductive adhesive;bend testing;flexible substrate
Abstract in different language: The paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton foil with Cu pattern and PET foil with Ag pattern) were used for the experiment. The purpose of the experiment was to achieve reliable joints after the bend testing and compare these joints prepared with different adhesives on different substrates.. The electrical resistance and the mechanical shear strength of the joints were measured before and after the test. Results show that bending of prepared samples is possible without significant changes of properties. Results also show significant influence of substrate type and used adhesive on these properties.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/36557

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