| Title: | Determination of Cohesive Parameters for Mode II of Epoxy Adhesive |
| Other Titles: | Stanovení kohezivních parametrů pro mód II epoxidového lepidla |
| Authors: | Kalina, Tomáš |
| Citation: | KALINA, T. Determination of Cohesive Parameters for Mode II of Epoxy Adhesive. Manufacturing Technology, 2020, roč. 20, č. 2, s. 190-194. ISSN 1213-2489. |
| Issue Date: | 2020 |
| Publisher: | J. E. Purkyne University in Usti nad Labem |
| Document type: | článek article |
| URI: | 2-s2.0-85090404951 http://hdl.handle.net/11025/42528 |
| ISSN: | 1213-2489 |
| Keywords: | koheze, deformační energie, Scotch-Weld DP490 3M, mód II, ENF |
| Keywords in different language: | Cohesion, Strain energy, Scotch-Weld DP490 3M, Mode II, ENF |
| Abstract: | Tento článek je zaměřen na stanovení kohezivních parametrů epoxidového lepidla Scotch-Weld DP490 3M, konkrétně na mód II. Bylo provedeno experimentální měření na zkušebních vzorcích dle ASTM D7905. Výsledky experimentálního textování byly srovnány s numerickými simulacemi téhož testu. Kohezivní parametry byly získány na základě vyhodnocení experimentálního měření a numerických simulací. Kohezivní parametry mohou být dále využity pro návrh složitějšího reálného lepeného spoje. Kritická hodnota deformační energie pro mód II (GIIc) byla stanovena na 2 321.3 [J/m^2=N/m]. Tuhost lepidla (kII) byla stanovena na 140 [GPa/m]. |
| Abstract in different language: | The paper deals with the determination of cohesive parameters of adhesive Scotch-Weld DP490 3M. Mode II of cohesive damage were examined. Experimental testing was performed on the test specimens to determine the mechanical properties of the adhesive according to ASTM D7905. The results of the experimental testing were compared with the numerical simulation of the same test. The cohesive parameters of the adhesive were obtained from the numerical simulation. Cohesive parameters of adhesive can be used to design real complex adhesive bonded joints. Cohesive models (specifically cohesive contacts or cohesive elements) are one of the most accurate methods of modeling adhesive bonded joints, so this method is mainly used for parts where it is necessary to ensure sufficient strength, such as in automotive, aviation, etc. Based on numerical simulation cohesive parameters of adhe-sive Scotch-Weld DP490 for mode II were obtained. Critical value of the strain energy release for Mode II conditions (GIIc) was determined to be equal to 2 321.3 [J/m^2=N/m]. Stiffness of the adhesive (kII) was determined to be equal to 140 [GPa/m]. |
| Rights: | © J. E. Purkyne University in Usti nad Labem |
| Appears in Collections: | Články / Articles (KKS) OBD |
Files in This Item:
| File | Size | Format | |
|---|---|---|---|
| _MT-MANUFACTURING_TECHNOLOGY-2020-KALINA-Determination of Cohesive Parameters for Mode II of Epoxy Adhesive.pdf | 643 kB | Adobe PDF | View/Open |
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