Title: Solderability dependence on surface roughness
Authors: Novák, Tomáš
Starý, Jiří
Steiner, František
Stejskal, Petr
Citation: Electroscope. 2009, Konference EDS 2009.
Issue Date: 21-Nov-2009
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
konferenční příspěvek
article
conferenceObject
URI: http://147.228.94.30/images/PDF/Rocnik2009/EDS_2009/novak.pdf
http://hdl.handle.net/11025/536
ISSN: 1802-4564
Keywords: pájitelnost;drsnost povrchu;elektrotechnická diagnostika
Keywords in different language: solderability;surface roughness;electrical diagnostics
Abstract in different language: The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester.
Rights: Copyright © 2007-2010 Electroscope. All Rights Reserved.
Appears in Collections:Konference EDS 2009
Články / Articles (KET)
EDS 2009 (2009)

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