Title: A novel laboratory anodic bonding device for MEMS applications
Authors: Pekárek, Jan
Háze, Jiří
Pavlík, Michal
Vrba, Radimír
Citation: Electroscope. 2010, č. 3, EDS 2010.
Issue Date: 2010
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: konferenční příspěvek
ISSN: 1802-4564
Keywords: anodické lepení;aplikace MEMS
Keywords in different language: anodic bonding;MEMS applications
Abstract in different language: The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 °C and by applying an external DC electric field in a range of 500 – 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.
Rights: Copyright © 2007-2010 Electroscope. All Rights Reserved.
Appears in Collections:Číslo 3 - EDS 2010 (2010)
Číslo 3 - EDS 2010 (2010)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/585

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