| Title: | Vlastnosti měděných a stříbrných tlustých vrstev na keramických substrátech |
| Other Titles: | Properties of copper and silver thick films on ceramic substrates |
| Authors: | Hlína, Jiří Řebou, Jan Hamáček, Aleš |
| Citation: | FIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 26. – 27. října 2017. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2017, s. [130-134]. |
| Issue Date: | 2017 |
| Publisher: | Západočeská univerzita v Plzni |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://hdl.handle.net/11025/26467 |
| ISBN: | 978–80–261–0712–5 |
| Keywords: | oxid hlinitý;měď;stříbro;tlusté vrstvy |
| Keywords in different language: | alumina;copper;silver;thick film |
| Abstract in different language: | This paper is focused on comparison of copper (Thick Printed Copper) and silver thick films on alumina substrates properties. Thick film technology is used in many fields of electronic industry. Thick printed copper is a new prospective technology, which is used for power electronics substrate manufacturing. Comparison of adhesion, solderability and other properties of TPC technology and silver thick films are mentioned in this paper. |
| Rights: | © Západočeská univerzita v Plzni |
| Appears in Collections: | 2017 2017 |
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