Title:	Degradation of Al-1%Si wires bonded onto copper pads
Authors:	Vehec, Igor Pietriková, Alena Čech, Peter
Citation:	Electroscope. 2017, č. 2.
Issue Date:	2017
Publisher:	Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type:	článek article
URI:	http://hdl.handle.net/11025/26596
ISSN:	1802-4564
Keywords:	zatížení;Al-1%Si dráty;elektromigrační fenomén
Keywords in different language:	power load;Al-1%Si wires;electromigration phenomenon
Abstract in different language:	The current load and its influence on degradation of Al-1%Si wires bonded onto copper pads is presented in this paper. The current load was chosen to occur the electromigration phenomenon during ageing. Our attention was paid to the direction of current from Cu pad to Al wire, and as well as reversed from Al wire to Cu pad. The dependencies of electrical resistance (ΔR/R0) relative change vs time as well as dependencies of mechanical strength vs time for different types of current stresses (direct current IDC and pulse current IPULSE) were obtained and evaluated. The results were evaluated in relation to all above mentioned conditions moreover thermal ageing at 100°C/1000 h was applied and evaluated too.
Rights:	Copyright © 2007-2010 Electroscope. All Rights Reserved.
Appears in Collections:	Číslo 2 (2017) - IMAPS flash Conference 2017 Číslo 2 (2017) - IMAPS flash Conference 2017

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