Title: SIMCENTER, engineering complex products from Siemens PLM Software for electronic cooling
Authors: Trubelová, Šárka
Citation: Electroscope. 2018, č. 1.
Issue Date: 2018
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
ISSN: 1802-4564
Keywords: elektronická zařízení;elektronické chlazení;chytrá technologie;SimcenterTM
Keywords in different language: electronic devices;electronic cooling;smart technology;SimcenterTM
Abstract in different language: For electronic devices, temperature is a limiting factor. Packing technology, driven by constant consumer demand and competitive pressure, allows higher power density than current cooling technology can handle. Sustained elevated temperatures act to not only reduce component efficiency, but also to reduce product life. We present a unique platform SimcenterTM that enables predictive engineering analytics by bringing a strong alignment between 1D simulation and 3D computer-aided engineering (CAE).
Rights: Copyright © 2018 Electroscope. All Rights Reserved.
Appears in Collections:Číslo 1 (2018)
Číslo 1 (2018)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/31004

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