Title: Effect of thermal stress and constitution of lead-free soldering alloys on creation and growth of IMC
Authors: Novák, Tomáš
Steiner, František
Citation: Electroscope. 2010, č. 3, EDS 2010.
Issue Date: 2010
Publisher: Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type: článek
konferenční příspěvek
ISSN: 1802-4564
Keywords: intermetalické sloučeniny;bezolovnaté pájení;tepelný stres
Keywords in different language: intermetallic compounds;lead-free soldering;thermal stress
Abstract in different language: This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere and that didn’t put though any external influence. Tested samples of another groups were thermal stressed in hot-air oven at 150 °C. Another group of samples are presented to make identification of time dependence of intermetallic compound growth possible. Today, electron microscopy is mainly used for analysis of solder joints structure and determination of intermetallic compound layer size. Using this analysis, constitution of individual compounds can be exactly determined. Electron microscopy is not the only way to analyze structure of solder joints. For comparison, analysis of solder joints structure by confocal microscope Olympus LEXT 3000 are presented in this article as well.
Rights: Copyright © 2007-2010 Electroscope. All Rights Reserved.
Appears in Collections:Číslo 3 - EDS 2010 (2010)
Články / Articles (KET)
Číslo 3 - EDS 2010 (2010)

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