Title: Vlastnosti vícevrstvých TPC struktur
Other Titles: Properties of multilayer TPC structures
Authors: Hlína, Jiří
Řeboun, Jan
Hamáček, Aleš
Citation: Elektrotechnika a informatika 2018: XIX. ročník konference doktorských prací, Zámek Nečtiny, 25. – 26. října 2018: Elektrotechnika, Elektronika, Elektroenergetika, 2018. 186 s. ISBN 978–80–261–0785–9.
Issue Date: 2018
Publisher: Západočeská univerzita v Plzni
Document type: konferenční příspěvek
conferenceObject
URI: http://hdl.handle.net/11025/30698
ISBN: 978–80–261–0785–9
Keywords: alumina;měď;vícevrstvá struktura;tlustá vrstva
Keywords in different language: alumina;copper;multilayer structure;thick film
Abstract in different language: This paper is focused on multilayer Thick Printed Copper (TPC) structures on alumina substrates and the testing of their mechanical and electrical properties. Multilayer thick printed copper is a new prospective technology based on sequential printing of copper and dielectric films and their firing in an inert atmosphere. It can be used for power electronics substrate manufacturing. These substrates are used in special applications such as concentrated photovoltaics, smart power modules etc. Adhesion and electrical parameters such as capacity, dielectric constant, resistivity, breakdown voltage, dielectric strength etc. before and after thermal cycling and aging are mentioned in this paper.
Appears in Collections:Konferenční příspěvky / Conference papers (KET)
2018
2018

Files in This Item:
File Description SizeFormat 
Hlina.pdfPlný text714,46 kBAdobe PDFView/Open


Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/30698

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.